Formula one:
618# 100 DTA 8 DBP 20 AL2O3(200 mesh) 100
Curing conditions: pressure ( MPa) / temperature °C / time (h) 0.05/20 °C / 24h τ = 18MPa For metal glass and ceramic bonding.
Formula two:
618# 100 Diethylpropylamine 8 DBP 20 AL2O3 100
0.05/20°C/48h τ >20MPa Use Same as above.
Formula 3: HYJ-6#
618# 100 DBP 15 AL2O3 25 2#SiO2 2-5 Tetraethylene pentamine 12
0.05/20°C/48h AL/Glass steel >20MPa Suitable for metal/glass-steel bonding.
Formula 4:
618# 100 Phenylenediamine 18 600# Diluent 10 Resorcinol 10
0.05/20°C/24h τ=17.5MPa τ200°C=5.0MPa for heat-resistant joint bonding.
Formula 5: 913#
Group A: 601# Epoxy 600# Diluent 201# Polyester Aluminum Powder and Quartz Powder
Group B: BF3 Diethyl Tetrahydrofuran A3PO4 A: B=10:1
0.05/15°C/6h τ=19MPa Rapid curing at low temperatures is suitable for cold areas.
Formula 6:
Tetrahydrofuran polyether epoxy 5 590# curing agent KH-550 0.2
0.05/30°C/30h τ-196°C=21MPa τ>6.5MPa Suitable for ultra-low temperature metal bonding.
Formula seven: 508#
6101# Epoxy 100 647# Anhydride 60 TiO2 50 Glass Powder 50
0.05/150°C/3h τ=13.1MPa τ steel=26.7MPa Suitable for metal bonding.
Recipe VIII: 618# 100
Phthalic Anhydride 40 Polyester Resin 20 AL2O3 50
0.05/140°C/4h τ>20MPa τ150°C=8-10.0MPa Use Same as above.
Formula 9:
618# 100 650# Polyamide
0.05/20°C/24h 100-120 τ>15MPa Used for metal plastic ceramic wood bonding.
Formula 10: KH-514#
Group A: 618# 2000# Epoxy
Group B: 651# polyamide DMP-30 KH-560 mixed amine (m-phenylenediamine: 4,4 Ì-diaminodiphenylmethane)
A:B=12:7
0.05/60°C/3h τ≥25MPa for metal bonding.
Formula XI: J-11# glue
6101# Epoxy Resin 120 200# Polyamide 100 600# Thinner 24 Phenylenediamine 6.5 KH-50 2.5
0.05/20°C/24-36h τ-120°C=15Mpa τ≥20Mpa τ120°C=3.0～4.0Mpa Metal bonding.
Formulation 12: 250# glue
4,4-dihydroxydiphenyl sulfone epoxy 100 618# 100 200# polyamide 200D-1
7 epoxy resin 20 liquid nitrile 10 acetone right amount
0.05/50°C/16 τ=40MPa Suitable for high strength metal bonding.
Formula 13: 711#
Group A: 6101# epoxy resin 40 634# epoxy resin 40 600# diluent 20 dioctyl sebacate 10
Group B: 651# Polyamide 38.5 A: B=100:35
0.05/25°C/24h τ-40°C=21.9Mpa τ=28.0Mpa τ50°C=12.8Mpa For bonding of metal plastics and ceramics.
Formula 14: E-12#
Group A: Urethane tetrafunctional epoxy resin 20 Polyethylene oreacetaldehyde 20 Ethyl orthosilicate 1
Group B: 2E4BZ 2 Acetone: Normal Alcohol (7:3) 8
A: B = 41:10
0.02/120°C/4h τ>20Mpa, 150°C=12MPa metal bonding.
Formula 15:
618# 100 Ethyl Orthosilicate 8 DTA 8
0.05/20°C/24h τ20°C>16MPa τ100°C>11MPa (good water resistance), cermet bonding.
Formula sixteen: MS-2#
6101# epoxy resin 100 JLY-121# polysulfide 10 microcapsules (containing 4,4 Ì-diaminodiphenylmethane) 50
0.05/130°C/2h τ=25MPa τ120°C=4.0MPa Metal bonding.
Formula 17: Agricultural Machinery - 2#
A: 6101# epoxy 100 DBP 15 quicklime (160 mesh) 30
B: DTA (50%) 20 DMP-30 (31.4%) 20 Thiamine (18.6%) 20
25°C/2～3h τ=16～18MPa Uniform tear strength>1.5MPa Metal and wood glass bonding.
Formula 18: KH-802#
618# 100 CTBN 15～25 Dicyandiamide 9 2#SiO 2 2～3
150～160°C/3h τ≥30MPa Metal bonding.
Formulation 19: HY911-III
Group A: 618# hydroxyl-terminated polybutadiene quartz powder 2#SiO2
Group B: 634# epoxy resin tetrahydrofuran H3PO4 A: B=3-9:1
30°C/3h τ=24.3MPa Rapid repair of structural adhesive at room temperature.
Formula 10: 618#, JLY-121# polysulfide, curing agent
τ 45 # steel ≥ 35MPa is a plastic glass bonding.
Formula XI: KH-223#
618# 100 CTBN 25 to 35 2E4ME 10 2#SiO2 0 to 2
0.05/80°C/4h τ≥30MPa τ 100°C≥15MPa Metal bonding.
Formulation twelve: HYJ-29#
618# 100 CTBN 16 Al2O3 25 2E4BZ 8 2#SiO2 2 to 5
0.05/70°C/3h τ>11MPa τ110°C>9MPa Metal/FRP bonding.
Formulation 13: KH-511#
618# 100 Butyronitrile-40 18-20 Phenylenediamine 14 2E4BZ 4
0.05/120°C/3h τ>30MPa τ100°C≥25MPa Metal bonding (below 100°C).
Formula 14:
AG-80# 100 Polyvinyl butyral 100 Ethyl orthosilicate 5 Acetone: Ethanol = 7:3 40
See recipe 44 for curing conditions and properties .
Formula 15: HY-914#
Group A: 711# epoxy 70 712# epoxy 52 601# epoxy 20
LP-2 Polysulfide (JLY-124#) 20 Quartz Powder 40 2#SiO2 2
Group B: 703 curing agent 36 DMP-30 1 KH-550 2 A: B=5-6:1
0.05/25°C/3h (E-20) τ=23～25MPa T-type peel strength 0.23MPa Metal, plastic, ceramic bonding.
Formulation 16: HY-914II
Group A: 711# 712# 601# JLY-124 polysulfide quartz powder (270 mesh) 2#SiO2
Group B: 701 Hardener DMP-30 KH-550 2#SiO2 Quartz Powder A:B=2.5:1
0.05/25°C/6～8h τ=15～20MPa T-type peel strength 0.35MPa Metal-glass-ceramic Perspex ABS Polyamide Adhesive.
Formula 17: Aircraft glue 1#
Group A: 6101# epoxy resin 100 662# epoxy resin 8 LP-3 polysulfide (JLY-121#) 30 zinc powder 100
Group B: imidazole-amine curing agent 16 metal bonding DMP-30 6 KH-550 3 Note: imidazole-amine curing agent (618# and 2E4BZ1:1 mixed for 2h and 2 parts of DTA reacted at 50°C for 1h) A:B =1:1
0.05/20°C/24h τ-60°C=16-17MPa τ=21-23MPa τ60°C=17-19MPa.
Formula 18:
618# 80 D-17# 20 300# Polyamide 10 2E4BZ 5 Aluminum Powder 20～25
80°C/8h τ=23MPa τ100°C=15MPa Metal bonding.
Formula 19:
618# 100 JLY-121# Polysulfide 30 650# Polyamide 30 Hexahydropyridine 5
100°C/3h τ=28MPa Non-uniform tear strength of 450N/cm metal bonding.
Formula 20:
618# 100 JLY-121# 20 Diamine 10 Hexamethylenetetramine 5 Quartz Powder 50
20°C/24～48h+60°C/4h τ=15MPa τ100°C=4MPa The active period is 2～3h.
Formula twenty-one:
618# 100 Butyronitrile-40 16 647# Anhydride 80 2E4BZ 2
1.0/120°C/3h τ=27.3MPa τ-60°C=22.4MPa τ200°C=2.6MPa The maximum operating temperature is 200°C.
Formula twenty-two:
E-42 100 Benzophenone dianhydride 48 Aluminum powder (325 mesh) 100 2#SiO2 3
After 200°C/2h τ=17.5MPa τ260°C=8.6MPa 260°C aging for 103h, the strength retention was 85%.
Formula twenty-three:
618# 100 W-95 Epoxy Resin 100 4,4-Diaminodiphenyl Methane 116 KH-550 4 D
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