Patent name: Package floor of air conditioner compressor

Patent name: Package floor of air-conditioning compressor Patent application number: 03124093.3 Publication number: CN1541911
Application Date: 2003.05.01 Public Day: 2004.11.03
Applicant: Lejin Electronics (Tianjin) Electric Co., Ltd. The present invention discloses a package bottom plate of an air conditioner compressor which is a polygon groove formed by connecting the surface cardboards between two original adjacent polygonal grooves. The packaging bottom plate of the air-conditioning compressor provided is a polygonal groove that can connect two adjacent grooves of the prior art to form two air-conditioning compressors, because the fixed end of the air-conditioning compressor is not affected, and The length of the die cutting line can be reduced by 30%, which can significantly reduce the deformation of the package bottom plate and improve the reliability of the package.

Source: Chinese Packaging